available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 model 100200 - 4x50 - 2 features: ? dc C 3 .0 g hz ? 30 watts ? beo ceramic ? non - nichrome resistive element ? low vswr ? 100% tested chip termination 30 watts , 50? general specifications resistive element thick film substrate beryllium oxide ceramic terminals thick film silver ele ctrical specifications resistance range : 50 ohms, 2 % frequency range; dc C 3 .0 g hz power: 30 watts vswr 1. 25 :1 dc C 3 .0 ghz note: tolerance is ? 0.010, unless otherwise specified. designed to meet of exceed applicable portions of mil - e - 5400. operating temperature is - 55 o c to 1 50 oc (see chart for derating temperatures). all dimensions in inches. specifications subject to change with out notice. outline drawing 100200 - 4x50 - 2 (097) rev b
usa/canada: toll free: europe: (315) 432 - 8909 (800) 544 - 2414 +44 2392 - 232392 available on tape and reel for pick and place manufacturing. model 100200 - 4x50 - 2 typical perfor mance : power de - rating: mounting footprint and procedure: 100200 - 4x50 - 2 (097) rev b suggested mounting procedures: 1. make sure that the devices are mounted on flat surfaces (.001" under the device) to optimize the heat transfer. drill & tap the heatsink for the appropriate 2. thread size to be used. 3. coat heatsink with a minimum amount of high quality silicone grease (.001" max. thickness). 4. position device on mounting surface & secure using socket head screws, flat & split washer. torque screws to the appropriate value. make 5. sure that the device is flat against the heatsink. (care should be taken to avoid upward pressure of the leads towards the lid). solder leads in place using approproate solder with a controlled temperature iron. ** for more details contact factory ** not recommended application board lower than lead. than lead. board higher scale: none scale: none board even with lead. than lead. board lower suggested stress relief methods (2 places) .025 min. suggested mounting procedures: 1. make sure that the devices are mounted on flat surfaces (.001" under the device) to optimize the heat transfer. drill & tap the heatsink for the appropriate 2. thread size to be used. 3. coat heatsink with a minimum amount of high quality silicone grease (.001" max. thickness). 4. position device on mounting surface & secure using socket head screws, flat & split washer. torque screws to the appropriate value. make 5. sure that the device is flat against the heatsink. (care should be taken to avoid upward pressure of the leads towards the lid). solder leads in place using approproate solder with a controlled temperature iron. ** for more details contact factory ** not recommended application board lower than lead. than lead. board higher scale: none scale: none board even with lead. than lead. board lower suggested stress relief methods (2 places) .025 min.
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